FEI-Zyfer

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FEI-Zyfer was an early adopter of Precise Positioning Service-Security Module (PPS-SM)military-grade GPS Receivers, and was the first Host Application Equipment (HAE) integrator of Selective Availability Anti-Spoofing Module (SAASM) military-grade GPS Receivers. To date, FEI-Zyfer has provided more than 4,000 SAASM-equipped GPS-Disciplined Time and Frequency Reference systems to the U.S. Department of Defense and Agencies, and to U.S. Government-approved Allies through the Foreign Military Sale (FMS) and Direct Commercial Sale (DCS) processes.

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FEI-Zyfer's core-competencies are:

• Design, development and manufacture of COTS and Custom GPS (and GNSS)-based Position, Navigation, Timing and Frequency Reference Systems for use in ground/ ground mobile, shipboard and airborne applications;

• Performance optimization of our A-PNT&F systems for applications such as:

- SIGINT, COMINT and ELINT systems which provide precise timing, synchronization and position to support cooperative engagement functions for precise geolocation when employed on ground/ground mobile, shipboard and airborne manned/unmanned platforms;

- Phased Array Radar, Targeting and Fire Control Systems for Missile Defense;

- Tactical Data Link GPS-references which support basic and advanced TDL functions including video and precise participant location and identification (PPLI);

- SAASM PPS and M-Code Disciplined Time and Frequency Reference and Measurement Systems which build, prioritize and monitor an ensemble of external references with differing accuracies and stabilities, including Cesium Clocks, Two-Way Satellite Time Transfer (TWSTT) modems, eLoran Receivers, and Fiber Optic and RF-based modems for Assured - Position, Navigation and Timing requirements in accordance with CJCSI 6130.01F/G;

- Regional A-PNT&F reference systems for deployed military and agency programs which minimize timing and synchronization dependence on GPS

- Fiber optic cross-linked Multiple Master and fiber optic cross-linked Master to Multiple Slave systems for maximum redundancy;

• Resilient system and enclosure designs that maintain required performance levels when subjected to shock, vibration, velocity, 2-D and 3-D acceleration, temperature, altitude, and other environmental conditions typically encountered in deployed applications;